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  Datasheet File OCR Text:
 SHINDENGEN
General Purpose Rectifiers
SIL Bridges
D15XB20
200V 15A
FEATURES
OUTLINE DIMENSIONS
Case : 5S
Unit : mm
*oeSingle In-Line Package Thin
*oe High current capacity with Small Package *oe High IFSM *oe Superior Thermal Conductivity APPLICATION *oe Switching power supply *oe Home Appliances, Office Equipment *oe Factory Automation, Inverter
RATINGS
*oeAbsolute Maximum Ratings (If not specified Tc=25*Z) Item Symbol Conditions Ratings Unit Storage Temperature Tstg -40*150 *Z Operating Junction Temperature Tj 150 *Z Maximum Reverse Voltage VRM 200 V IO Average Rectified Forward Current50Hz sine wave, R-load With heatsink Tc=100*Z 15 A 50Hz sine wave, R-load Without heatsink Ta=25*Z 3.2 Peak Surge Forward CurrentIFSM 50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25*Z A 200 Current Squared Time I2t 1ms*...t*10ms*@Tj=25*Z 110 A2s Dielectric Strength Vdis Terminals to case, AC 1 minute 2.5 kV Mounting Torque TOR * ecommended torque*0.5Nm*j R i F 0.8 Nm *oeElectrical Characteristics (If not specified Tc=25*Z) Item Symbol Conditions Ratings Unit VF I =7.5A, Pulse measurement, Rating of per diode Forward Voltage Max.1.1 V F IR V=V , Pulse measurement, Rating of per diode Max.10 EA Reverse Current R RM AEjc junction to case *@*@With heatsink Max.1.5 Thermal Resistance AEjl junction to lead *@ *@ Without heatsink Max.5 *Z/W AEja junction to ambient Without heatsink Max.22
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
D15XBx
Forward Voltage
10
Forward Current IF [A]
Tc=150C [TYP]
Tc=25C [TYP] 1
Pulse measurement per diode
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Forward Voltage VF [V]
D15XBx
60
Forward Power Dissipation
SIN
Forward Power Dissipation PF [W]
50
40
30
20
10
0
0
5
10
15
20
25
Average Rectified Forward Current IO [A]
Tj = 150C Sine wave
D15XBx
20
Derating Curve
Heatsink Tc Tc
Average Rectified Forward Current IO [A]
SIN 15
10
5
0 80
90
100
110
120
130
140
150
160
Case Temperature Tc [C]
Sine wave R-load with heatsink
D15XBx
5
Derating Curve
Average Rectified Forward Current IO [A]
4 SIN 3
PCB Glass-epoxy substrate Soldering land 5mm
2
1
0
0
20
40
60
80
100
120
140
160
Ambient Temperature Ta [C]
Sine wave R-load Free in air
D15XBx
250
Peak Surge Forward Capability
IFSM
10ms 10ms
1 cycle
200
Peak Surge Forward Current IFSM [A]
non-repetitive, sine wave, Tj=25C before surge current is applied
150
100
50
0
1
2
5
10
20
50
100
Number of Cycles [cycles]


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